文章基本信息

标题：Thermoplastic Epoxide Resin in the Presence of Polyethylene Glycol as Hot-melt Adhesive in Clean Technology
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作者：G.S. Mukherjee ; N. Shukla ; R.K. Singh 等
期刊名称：Defence Science Journal
印刷版ISSN：0976-464X
出版年度：2004
卷号：54
期号：2
页码：249-255
DOI：10.14429/dsj.54.2038
语种：English
出版社：Defence Scientific Information & Documentation Centre
摘要：Pollution caused by the process involving handling of solvents is considered as one of the most serious ecological problems. In this perspective, thermoplastic epoxide resins were synthesized from the controlled reaction of bisphenol A, epichlorohydrine, and 3,5 dimethylaniline with a view to prepare ingredients for hot melt adhesive) was designated as HMA/(Subscript)35' Addition of polyethylene glycol (20 Wt per cent) of molecular weight 6000 (PEG6K) in the blend was found to be optimum towards providing maximum tensile lap shear strength with reference to aluminium/adhesive/aluminium bonding with a value of 5.05MPa. The matrix of the blend remains optically transparent till the content of PEG6K remains up to 20 Wt per cent; however beyond 20 Wt percent of PEG6k, the matrix becomes opaque with the appearance of spherulities due to presence of excess PEG6K in the blend. Interestingly, blends containing <= 20 Wt percent PEG6K showed no endotherm below 100 (Degree)C even though the melting point of pristine PEG6K is 55 (degree)C. FTIR data revealed the interactive role of PEG6K with the epoxide resin.
关键词：Epoxy resin, solvents, adhesive,polyethylene glycol (PEG), HMA, hot-melt adhesive, clean technology . HMA, PEG6K, thermoplastic epoxide resins