文章基本信息

标题：An Improved Quad Flat Package for High Frequency SiP Applications
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作者：Haiyan Sun ; Ling Sun
期刊名称：International Journal of Future Generation Communication and Networking
印刷版ISSN：2233-7857
出版年度：2013
卷号：6
期号：6
页码：37-46
出版社：SERSC
摘要：This paper describes four cascade coplanar transmission line structures built into the quad flat pack (QFP) lead frame for high-frequency system in package (SiP) applications. Adjacent ground leads are used to provide return paths in a coplanar configuration, thereby minimizing impedance mismatch. Due to the complexity level in QFP structure, full-wave electromagnetic simulations have been performed to extract the S-parameter. Time Domain Reflectometry (TDR) is also used to help in understanding the contributing to the SiP structure. The SiP has also been fabricated and good correlation with electromagnetic simulations is also achieved
关键词：Quad flat package; system in package; electromagnetic modelling; coplanar ;transmission line structure