文章基本信息

标题：450 mm Silicon Wafer:Economical and Technical Challenges
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作者：Ankita Chaturvedi ; Pallavie Tyagi ; Shivaji Tyagi 等
期刊名称：International Journal of Computer Technology and Applications
电子版ISSN：2229-6093
出版年度：2012
卷号：3
期号：3
页码：1077-1081
出版社：Technopark Publications
摘要：Following Moore’s law semiconductor industry had acquired unprecedented growth by providing more capability at equal or low cost. Semiconductor industry increased the wafer size with new fab architecture at every ten years while technological and device advancements like miniaturization, new materials, silicon waste reduction, design and manufacturing process improvements at every two years which has reduced the cost per function. The capital investments require in overall factory integration has increased. This paper discusses the economical and technical issues regarding the transition to 450 mm. Technical challenges can be handled by making contemporary changes across semiconductor industry
关键词：450 mm Wafer Diameter; fab economis; manufacturing process; wafer thickness