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  • 标题:A Multilayer 2D FEM Approach for Solving 3D Thermal Problems is Electronic Boards for Spatial Applications
  • 本地全文:下载
  • 作者:Axel Larrateguy ; Pablo Carrica
  • 期刊名称:Mecánica Computacional
  • 印刷版ISSN:2591-3522
  • 出版年度:2000
  • 卷号:XIXB
  • 期号:14
  • 页码:507-512
  • 出版社:CIMEC-INTEC-CONICET-UNL
  • 摘要:A thermal model to predict the temperature distribution on the electronic boards of Argentinian satellite SAC-C is presented. A simple model of the box that contains the
    boards provides the boundary conditions for the thermal calculation of the boards itself.
    The 3D thermal problem of each board was solved with a novel 2D multilayer FEM developed by the authors. This approach is aplicable because no convection colling is present and thermal radiation can be conservatively neglected.
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