文章基本信息

标题：On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip
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作者：Jian Lu ; Hongwei Jia ; Andres Arias 等
期刊名称：Advances in Power Electronics
印刷版ISSN：2090-181X
电子版ISSN：2090-1828
出版年度：2008
卷号：2008
DOI：10.1155/2008/678415
出版社：Hindawi Publishing Corporation
摘要：A novel concept of on-chip bondwire inductors and transformers with ferrite epoxy glob coating is proposed to offer a cost effective approach realizing power systems on chip (SOC). We have investigated the concept both experimentally and with finite element modeling. A Q factor of 30–40 is experimentally demonstrated for the bondwire inductors which represents an improvement by a factor of 3–30 over the state-of-the-art MEMS micromachined inductors. Transformer parameters including self- and mutual inductance and coupling factors are extracted from both modeled and measured S-parameters. More importantly, the bondwire magnetic components can be easily integrated into SOC manufacturing processes with minimal changes and open enormous possibilities for realizing cost-effective, high-current, high-efficiency power SOCs.