文章基本信息

标题：Autograph Assisted Mathematics Module Development to Improve Problem Solving Abilities and Mathematic Connection of High School Students
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作者：Dewi Anggraini ; Edi Syahputra ; Waminton Rajagukguk 等
期刊名称：Journal of Education and Practice
印刷版ISSN：2222-288X
电子版ISSN：2222-288X
出版年度：2020
卷号：11
期号：35
页码：10-13
DOI：10.7176/JEP/11-35-02
出版社：The International Institute for Science, Technology and Education (IISTE)
摘要：This study aims to determine: (1) the level of validity and effectiveness of the autograph-assisted mathematics module to improve the problem-solving abilities and mathematical connection abilities of the students of SMA MAN 1 Deli Serdang, (2) to increase the students 'mathematical problem solving abilities in the application of autograph-assisted mathematics modules, (3) to increase the students' mathematical connection abilities in application autograph-assisted math module.Researchers develop teaching materials in the form of autograph-assisted mathematics modules using the Dick & Carey development model. The module validation was carried out by three experts and two practitioners.
关键词：Development;Mathematics Module;Autograph;Problem Solving and Mathematical Connections