文章基本信息

标题：Improving the thermal conductivity of epoxy composites using a combustion-synthesized aggregated β-Si 3 N 4 filler with randomly oriented grains
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作者：Akihiro Shimamura ; Yuji Hotta ; Hideki Hyuga 等
期刊名称：Scientific Reports
电子版ISSN：2045-2322
出版年度：2020
卷号：10
期号：1
DOI：10.1038/s41598-020-71745-w
出版社：Springer Nature
摘要：Electrically insulating and thermally conductive polymer matrix composites are desirable for industry applications as they improve the reliability of high-performance electronic devices, particularly via heat dissipation in devices loaded with several electronic components. In this study, an aggregated β-Si3N4 filler with randomly oriented grains was produced via combustion synthesis to improve the thermal conductivity of epoxy composites. The thermal conductivities of the prepared composites were investigated as a function of the filler content, and the values were compared to those of composites loaded with commercial β-Si3N4 (non-aggregated). Negligible difference was observed in the thermal conductivities of both types of composites when the Si3N4 content was below 40 vol%; however, above 40 vol%, the aggregated β-Si3N4 filler-loaded composites showed higher thermal conductivities than the commercial β-Si3N4-loaded composites. The aggregated β-Si3N4 filler-loaded composites exhibited isotropic thermal conductivities with a maximum value of 4.7 W m−1 K−1 at 53 vol% filler content, which is approximately 2.4 times higher than that of the commercial β-Si3N4-loaded composites, thereby suggesting that the morphology of the aggregated filler would be more efficient than that of the commonly used non-aggregated filler in enhancing the thermal conductivity of a polymer matrix composite.