文章基本信息

标题：Effect of grain orientations of Cu seed layers on the growth of -oriented nanotwinned Cu
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作者：Chien-Min Liu ; Han-Wen Lin ; Chia-Ling Lu 等
期刊名称：Scientific Reports
电子版ISSN：2045-2322
出版年度：2015
卷号：4
期号：1
DOI：10.1038/srep06123
语种：English
出版社：Springer Nature
摘要：We investigate the growth of Cu films on two different Cu seed layers: one with regular -oriented grains and the other with very strong -preferred orientation. It is found that densely-packed nanotwinned Cu (nt-Cu) can be grown by pulsed electroplating on the strong -oriented Cu seed layer without a randomly-oriented transition layer between the nt-Cu and the Cu seed layer. The electroplated nt-Cu grow almost epitaxially on the seed layer and formed -oriented columnar structures. However, with the regular -oriented Cu seed, there is a randomly-oriented transition layer between the nt-Cu and the regular -oriented Cu seed. The results indicate that the seed layer plays a crucial role on the regularity of -oriented nanotwinned Cu.