文章基本信息

标题：Silver oxide decomposition mediated direct bonding of silicon-based materials
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作者：Tomoki Matsuda ; Kota Inami ; Keita Motoyama 等
期刊名称：Scientific Reports
电子版ISSN：2045-2322
出版年度：2018
卷号：8
期号：1
页码：10472
DOI：10.1038/s41598-018-28788-x
语种：English
出版社：Springer Nature
摘要：O paste, forming Ag nanoparticles (AgNPs). We demonstrate sound joints of Ag/silicon-based materials at 300-500 °C with the formation of a silicon oxide interlayer containing AgNPs. We propose that Ag in the interlayer attracted other Ag particles to the interface, playing a unique role in this direct bonding process. This process is suitable for various bonding applications in electronics, as well the fabrication of conducting paths for photovoltaic and other applications.