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  • 标题:Morphological evolution and migration behavior of silver thin films on flexible substrates during thermal cycle testing
  • 作者:Quan Sun ; Yebo Lu ; Xiaobin Xu
  • 期刊名称:Advances in Mechanical Engineering
  • 印刷版ISSN:1687-8140
  • 电子版ISSN:1687-8140
  • 出版年度:2018
  • 卷号:10
  • 期号:8
  • DOI:10.1177/1687814018795961
  • 语种:English
  • 出版社:Sage Publications Ltd.
  • 摘要:To understand morphological evolution and migration behavior caused by stress migration and thermal fatigue of silver thin films on flexible substrates, bending tests were conducted with different bending angles for two types of thermal tests. Furthermore, the effect of stress migration and thermal fatigue on the electrical conductivity of the silver thin films was discussed. The experimental samples were silver thin films printed on flexible paper for these tests. In an ultra-low cycle thermal test, the electrical conductivity of a silver film decreased with increasing bending angle because of the occurrence of voids caused by stress migration. Meanwhile, a high-cycle thermal test caused cracks to form and caused further deterioration of the electrical conductivity owing to a combination of stress migration and thermal fatigue.
  • 关键词:Atomic diffusion; high-cycle fatigue; thin structures; thermal analysis; stress
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