文章基本信息

标题：Aluminum plasmonic waveguides co-integrated with Si3N4 photonics using CMOS processes
本地全文：下载
作者：George Dabos ; Athanasios Manolis ; Dimitris Tsiokos 等
期刊名称：Scientific Reports
电子版ISSN：2045-2322
出版年度：2018
卷号：8
期号：1
页码：13380
DOI：10.1038/s41598-018-31736-4
语种：English
出版社：Springer Nature
摘要：Co-integrating CMOS plasmonics and photonics became the “sweet spot” to hit in order to combine their benefits and allow for volume manufacturing of plasmo-photonic integrated circuits. Plasmonics can naturally interface photonics with electronics while offering strong mode confinement, enabling in this way on-chip data interconnects when tailored to single-mode waveguides, as well as high-sensitivity biosensors when exposing Surface-Plasmon-Polariton (SPP) modes in aqueous environment. Their synergy with low-loss photonics can tolerate the high plasmonic propagation losses in interconnect applications, offering at the same time a powerful portfolio of passive photonic functions towards avoiding the use of bulk optics for SPP excitation and facilitating compact biosensor setups. The co-integration roadmap has to proceed, however, over the utilization of fully CMOS compatible material platforms and manufacturing processes in order to allow for a practical deployment route. Herein, we demonstrate for the first time Aluminum plasmonic waveguides co-integrated with Si₃N₄ photonics using CMOS manufacturing processes. We validate the data carrying credentials of CMOS plasmonics with 25 Gb/s data traffic and we confirm successful plasmonic propagation in both air and water-cladded waveguide configurations. This platform can potentially fuel the deployment of co-integrated plasmonic and photonic structures using CMOS processes for biosensing and on-chip interconnect applications.