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  • 标题:Scan-Chain Intra-Cell Aware Testing
  • 作者:Aymen Touati ; Alberto Bosio ; Patrick Girard
  • 期刊名称:IEEE Transactions on Emerging Topics in Computing
  • 印刷版ISSN:2168-6750
  • 出版年度:2018
  • 卷号:6
  • 期号:2
  • 页码:278-287
  • DOI:10.1109/TETC.2016.2624311
  • 出版社:IEEE Publishing
  • 摘要:This paper first presents an evaluation of the effectiveness of different test pattern sets in terms of ability to detect possible intra-cell defects affecting the scan flip-flops. The analysis is then used to develop an effective test solution to improve the overall test quality. As a major result, the paper demonstrates that by combining test vectors generated by a commercial ATPG to detect stuck-at and delay faults, plus a fragment of extra test patterns generated to specifically target the escaped defects, we can obtain a higher intra-cell defect coverage (i.e., 6.46 percent on average) and a shorter test time (i.e., 42.20 percent on average) than by straightforwardly using an ATPG which directly targets these defects.
  • 关键词:Fault simulation;intra-cell defect;scan-chain testing;test quality
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