文章基本信息

标题：Microencapsulation of Paraffin Wax Microspheres with Silver
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作者：Kh. Gopal Krishna Singh ; Sudipta Halder ; Sukumar Pati 等
期刊名称：Defence Science Journal
印刷版ISSN：0976-464X
出版年度：2018
卷号：68
期号：2
页码：218-224
语种：English
出版社：Defence Scientific Information & Documentation Centre
摘要：Microencapsulation of phase change materials (PCMs) with metallic shell materials is a very innovative and challenging task. This can mitigate the problems related to thermal barrier for conventional nonconductive shell materials as well as enhance mechanical properties of PCM microcapsules. Such microcapsules can be integrated into microelectronic devices for their intermittent thermal management in mission critical components. The present work is aimed at developing a new method to synthesise phase change material encapsulated with metallic shell material and characterising the same. Paraffin wax microspheres were first synthesised and then encapsulated with silver through in situ chemical reduction. Further more, a new set of experiments were identified to analyse the quality of encapsulation. The thermal properties were investigated under differential scanning calorimeter and thermogravimetric analyser. The average diameter of paraffin wax microspheres (PW) is found to be ±329 μm. It reveals from DSC analysis that the enthalpy of fusion is minimum for PW@Ag-PVA amongst all others. Accordingly, higher deposition of Ag is possible for PW@Ag-PVA. This is also supported by TGA results where PW@Ag-PVA has only 40 per cent mass loss and the remaining samples have 100 per cent. However, even for PW@Ag-PVA the encapsulation is found incomplete. The present work provides knowhow of the difficulties associated with encapsulation of PCMs with metallic shell material.
其他摘要：Microencapsulation of phase change materials (PCMs) with metallic shell materials is a very innovative and challenging task. This can mitigate the problems related to thermal barrier for conventional nonconductive shell materials as well as enhance mechanical properties of PCM microcapsules. Such microcapsules can be integrated into microelectronic devices for their intermittent thermal management in mission critical components. The present work is aimed at developing a new method to synthesise phase change material encapsulated with metallic shell material and characterising the same. Paraffin wax microspheres were first synthesised and then encapsulated with silver through in situ chemical reduction. Further more, a new set of experiments were identified to analyse the quality of encapsulation. The thermal properties were investigated under differential scanning calorimeter and thermogravimetric analyser. The average diameter of paraffin wax microspheres (PW) is found to be ±329 μm. It reveals from DSC analysis that the enthalpy of fusion is minimum for PW@Ag-PVA amongst all others. Accordingly, higher deposition of Ag is possible for PW@Ag-PVA. This is also supported by TGA results where PW@Ag-PVA has only 40 per cent mass loss and the remaining samples have 100 per cent. However, even for PW@Ag-PVA the encapsulation is found incomplete. The present work provides knowhow of the difficulties associated with encapsulation of PCMs with metallic shell material.
其他关键词：Microencapsulation;paraffin wax;Metallic shell material;Microelectronic thermal management