期刊名称：International Journal of Computer Science Issues
印刷版ISSN：1694-0784
电子版ISSN：1694-0814
出版年度：2011
卷号：8
期号：4
出版社：IJCSI Press
摘要：Recently, has emerged a new technology, substrate integrated waveguide (SIW), it has been applied successfully to the conception of planar compact components for the microwave and millimeter waves applications. Our study concerns the analysis of right bends of rectangular waveguides under SIW technology by the HFSS code, in order to simulate different chamfrain positions, through the analysis of the transmission coefficient S21. In order to reduce losses of the performance, it is usual to chamfrain the external wall of the waveguide. Thus, through this modeling, we have confirmed the optimal position of the chamfrain. A good agreement between HFSS simulations and reference results has been obtained.
Loading...
