文章基本信息

标题：Exploring the Technological Collaboration Characteristics of the Global Integrated Circuit Manufacturing Industry
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作者：Liu, Yun ; Yan, Zhe ; Cheng, Yijie 等
期刊名称：Sustainability
印刷版ISSN：2071-1050
出版年度：2018
卷号：10
期号：1
页码：1-23
出版社：MDPI, Open Access Journal
摘要：With the intensification of international competition, there are many international technological collaborations in the integrated circuit manufacturing (ICM) industry. The importance of improving the level of international technological collaboration is becoming more and more prominent. Therefore, it is vital for a country, a region, or an institution to understand the international technological collaboration characteristics of the ICM industry and, thus, to know how to enhance its own international technological collaboration. This paper depicts the international technological collaboration characteristics of the ICM industry based on patent analysis. Four aspects, which include collaboration patterns, collaboration networks, collaboration institutions, and collaboration impacts, are analyzed by utilizing patent association analysis and social network analysis. The findings include the following: first, in regard to international technological collaboration, the USA has the highest level, while Germany has great potential for future development; second, Asia and Europe have already formed clusters, respectively, in the cooperative network; last, but not least, research institutions, colleges, and universities should also actively participate in international collaboration. In general, this study provides an objective reference for policy making, competitiveness, and sustainability in the ICM industry. The framework presented in this paper could be applied to examine other industrial international technological collaborations.
关键词：international technological collaboration; IC manufacturing; patent association analysis; social network analysis; collaboration network