文章基本信息

标题：Thermal Simulation for Two-Phase Liquid Cooling 3D-ICs
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作者：Hong-Wen Chiou ; Yu-Min Lee
期刊名称：Journal of Computer and Communications
印刷版ISSN：2327-5219
电子版ISSN：2327-5227
出版年度：2016
卷号：04
期号：15
页码：33-45
DOI：10.4236/jcc.2016.415003
语种：English
出版社：Scientific Research Publishing
摘要：This work presents an algorithm for simulating more accurate temperature distribution in two-phase liquid cooling for three-dimensional integrated circuits than the state of-the-art methods by utilizing local multi-linear interpolation techniques on heat transfer coefficients between the microchannel and silicon substrate, and considering the interdependence between the thermal conductivity of silicon and temperature values. The experimental results show that the maximum and average errors are only 9.7% and 6.7% compared with the measurements, respectively.
关键词：Thermal Simulation;Microchannel;Two-Phase Liquid Cooling