期刊名称:International Journal of Advanced Research in Computer Engineering & Technology (IJARCET)
印刷版ISSN:2278-1323
出版年度:2012
卷号:1
期号:4
页码:194-195
出版社:Shri Pannalal Research Institute of Technolgy
摘要:In the present paper we discuss the isotropic etching of various films such as Aluminum, Titanium, Silicon dioxide& Silicon Nitride The second section of this paper contains anisotropic etching of Silicon using Silicon Nitride as a mask. Various types of etchant are available.The etch rate depends upon the pH, concentration and temperature in anisotropic etching. In isotropic etching etch rate depends upon concentration of the acidic medium.