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标题：Thermal nondestructive testing and spice simulation with approach of electro-thermal modelling
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作者：Chinmayee Jena ; Alok Kumar Singh
期刊名称：International Journal of Advanced Research in Computer Engineering & Technology (IJARCET)
印刷版ISSN：2278-1323
出版年度：2013
卷号：2
期号：7
页码：2217-2222
出版社：Shri Pannalal Research Institute of Technolgy
摘要：Non-destructive testing (NDT) refers to all the test methods, which permit testing or inspection of object without impairing its future usefulness. The aim of NDT is the detection of damages or unwanted irregularities like flaws, inclusions, material loss/degradation and local imperfections in material properties. Active infrared thermography is a nondestructive evaluation technique in which material is thermally stimulated by heat source and an infrared camera is generally used to record the resulting thermal transient at the surface of material. As the heat diffuses inside the materials, it gets perturbed by the presence of sub-surface defects, causing a temperature contrast at the surface, which is used for finding sub-surface defect. It is relatively fast, safe and non-contact and easy to use technique for large area scans. This sector presents the comparison between the experimental and simulated results obtained from 3D electrical model of active thermography using SPICE (Simulation Program with Integrated Circuit Emphasis). In the present work, this approach has been exploited in the interest of some active infrared thermography problems.
关键词：Non-destructive testing(NDT);Active infrared ; thermography; sub-surface defects; SPICE (Simulation Program ; with Integrated Circuit Emphasis); 3D electrical model.