文章基本信息

标题：Transient Characteristics of a Two-Phase Thermosyphon Loop for Multichip Module
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作者：Nam, Sang-Sig ; Choi, Sung-Bong ; Kim, Jae-Hee 等
期刊名称：ETRI Journal
印刷版ISSN：1225-6463
电子版ISSN：2233-7326
出版年度：1998
卷号：20
期号：3
页码：284-284
语种：English
出版社：Electronics and Telecommunications Research Institute
摘要：A new thermosyphon cooling module (TSCM) has designed, fabricated and tested to cool the multi-chip module consists of a cold plate and an integrated condenser. With an allowable temperature rise of on the surface of the heater, the cooling module TSCM can handle a heat flux of about 2.7 using R11 as working fluid. The transient characteristics of the cooling module have been proved to be excellent: that is, when a heat load is applied inside of the system, steady state can be achieved within 10 to 15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser in addition to the ambient and the condenser temperatures affect the system performance.