文章基本信息

标题：Silicon Micro-probe Card Using Porous Silicon Micromachining Technology
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作者：Kim, Young-Min ; Yoon, Ho-Cheol ; Lee, Jong-Hyun 等
期刊名称：ETRI Journal
印刷版ISSN：1225-6463
电子版ISSN：2233-7326
出版年度：2005
卷号：27
期号：4
页码：433-433
语种：English
出版社：Electronics and Telecommunications Research Institute
摘要：We present a new type of silicon micro-probe card using a three-dimensional probe beam of the cantilever type. It was fabricated using KOH and dry etching, a porous silicon micromachining technique, and an Au electroplating process. The cantilever-type probe beam had a thickness of , and a width of and a length of . The probe beam for pad contact was formed by the thermal expansion coefficient difference between the films. The maximum height of the curled probe beam was , and an annealing process was performed for 20 min at . The contact resistance of the newly fabricated probe card was less than , and its lifetime was more than 20,000 turns.
关键词：Silicon probe card;probe beam;porous silicon micromachining;contact resistance