文章基本信息

标题：Development of a Flat-Plate Cooling Device for Electronic Packaging
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作者：Moon, Seok-Hwan ; Hwang, Gunn ; Lim, Hyun-Taeck 等
期刊名称：ETRI Journal
印刷版ISSN：1225-6463
电子版ISSN：2233-7326
出版年度：2011
卷号：33
期号：4
页码：645-647
DOI：10.4218/etrij.11.0210.0322
语种：English
出版社：Electronics and Telecommunications Research Institute
摘要：In this study, a microcapillary pumped loop (MCPL) that can be used as a cooling device for small electronic and telecommunications equipment has been developed. For thin devices such as an MCPL, securing a vapor flow space is a critical issue for enhancing the thermal performance. In this letter, such enhancement in thermal performance was accomplished by eliminating condensed droplets from the vapor line. By fabricating the grooves in the vapor line to eliminate droplets, a decrease in thermal resistance of about 63.7% was achieved.
关键词：Electronic cooling;thermal packaging;thermal resistance;phase change;condensed droplet