文章基本信息

标题：Novel Bumping Material for Solder-on-Pad Technology
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作者：Choi, Kwang-Seong ; Chu, Sun-Woo ; Lee, Jong-Jin 等
期刊名称：ETRI Journal
印刷版ISSN：1225-6463
电子版ISSN：2233-7326
出版年度：2011
卷号：33
期号：4
页码：637-640
DOI：10.4218/etrij.11.0210.0298
语种：English
出版社：Electronics and Telecommunications Research Institute
摘要：A novel bumping material, which is composed of a resin and Sn3Ag0.5Cu (SAC305) solder power, has been developed for the maskless solder-on-pad technology of the fine-pitch flip-chip bonding. The functions of the resin are carrying solder powder and deoxidizing the oxide layer on the solder power for the bumping on the pad on the substrate. At the same time, it was designed to have minimal chemical reactions within the resin so that the cleaning process after the bumping on the pad can be achieved. With this material, the solder bump array was successfully formed with pitch of 150 in one direction.
关键词：Maskless bumping;solder-on-pad (SoP) technology;Sn3Ag0.5Cu solder;resin