文章基本信息

标题：Novel Bumping Process for Solder on Pad Technology
本地全文：下载
作者：Choi, Kwang-Seong ; Bae, Ho-Eun ; Bae, Hyun-Cheol 等
期刊名称：ETRI Journal
印刷版ISSN：1225-6463
电子版ISSN：2233-7326
出版年度：2013
卷号：35
期号：2
页码：340-343
DOI：10.4218/etrij.13.0212.0302
语种：English
出版社：Electronics and Telecommunications Research Institute
摘要：A novel bumping process using solder bump maker is developed for the maskless low-volume solder on pad (SoP) technology of fine-pitch flip chip bonding. The process includes two main steps: one is the aggregation of powdered solder on the metal pads on a substrate via an increase in temperature, and the other is the reflow of the deposited powder to form a low-volume SoP. Since the surface tension that exists when the solder is below its melting point is the major driving force of the solder deposit, only a small quantity of powdered solder adjacent to the pads can join the aggregation process to obtain a uniform, low-volume SoP array on the substrate, regardless of the pad configurations. Through this process, an SoP array on an organic substrate with a pitch of is successfully formed.
关键词：Maskless bumping;low-volume solder on pad (SoP) technology;resin;powdered solder;Sn3.0Ag0.5Cu