文章基本信息

标题：Dynamic Self-Repair Architectures for Defective Through-silicon Vias
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作者：Yang, Joon-Sung ; Han, Tae Hee ; Kobla, Darshan 等
期刊名称：ETRI Journal
印刷版ISSN：1225-6463
电子版ISSN：2233-7326
出版年度：2014
卷号：36
期号：2
页码：301-308
DOI：10.4218/etrij.14.0113.0578
语种：English
出版社：Electronics and Telecommunications Research Institute
摘要：Three-dimensional integration technology results in area savings, platform power savings, and an increase in performance. Through-silicon via (TSV) assembly and manufacturing processes can potentially introduce defects. This may result in increases in manufacturing and test costs and will cause a yield problem. To improve the yield, spare TSVs can be included to repair defective TSVs. This paper proposes a new built-in self-test feature to identify defective TSV channels. For defective TSVs, this paper also introduces dynamic self-repair architectures using code-based and hardware-mapping based repair.
关键词：Through-silicon via;built-in self test;dynamic self repair;code-based repair;hardware mapping based repair