文章基本信息

标题：HV-SoP Technology for Maskless Fine-Pitch Bumping Process
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作者：Son, Jihye ; Eom, Yong-Sung ; Choi, Kwang-Seong 等
期刊名称：ETRI Journal
印刷版ISSN：1225-6463
电子版ISSN：2233-7326
出版年度：2015
卷号：37
期号：3
页码：523-532
DOI：10.4218/etrij.15.0114.0578
语种：English
出版社：Electronics and Telecommunications Research Institute
摘要：Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are , , and , respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.
关键词：HV-SoP;maskless bumping;fine pitch;SBM;PCB;solder powder;resin