文章基本信息

标题：Enhanced thermal conductivity in copolymerized polyimide
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作者：Bohai Liu ; Yu Zhou ; Lan Dong 等
期刊名称：iScience
印刷版ISSN：2589-0042
出版年度：2022
卷号：25
期号：11
页码：1-11
DOI：10.1016/j.isci.2022.105451
语种：English
出版社：Elsevier
摘要：SummaryFrom flexible electronics and multifunctional textiles to artificial tissues, polymers penetrate nearly every aspect of modern technology. High thermal conductivity of polymers is often required in their applications, where heat dissipation is crucial to maintain product reliability and functionality. However, the intrinsic thermal conductivity of bulk polymers is largely hindered by the randomly coiled and entangled chain conformation. Here, we report a copolymerization strategy that can simultaneously manipulate the intrachain and interchain hopping and increase the thermal conductivity of linear copolymerized polyimide (PI) to three times higher than that of pure PI at a low-level introduction of 2,4,5,7-tetraamino-1,8-dihydroxyanthracene-9,10-dione (10%). In addition, the large-scale copolymerized PI films display thermal stability after annealing. These remarkable results allow bulk PI to be a potential candidate for thermal management, and this copolymerization method may benefit future synthesis of interfacial thermal materials.Graphical abstractDisplay OmittedHighlights•A copolymerization method to fabricate large-sized and thermally stable PI films•The intrachain and interchain hopping in the copolymer can be simultaneously enhanced•Thermal conductivity of copolymerized PI films is about 3x higher than that in pure PIPolymer chemistry; Thermal property; Polymers