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标题：TiO2/silicone encapsulation film for achieving optical performance improvement of chip-on-board packaging LED
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作者：My Hanh Nguyen Thi ; Phung Ton That
期刊名称：TELKOMNIKA (Telecommunication Computing Electronics and Control)
印刷版ISSN：2302-9293
出版年度：2021
卷号：19
期号：2
DOI：10.12928/telkomnika.v19i2.16755
语种：English
出版社：Universitas Ahmad Dahlan
摘要：TiO2 nanoparticle and silicon composite has powerful effect of scattering, thus it is famous in enhancing the scattered light in light-emitting diode (LED) packages. To accomplish higher lighting performance in LED devices, a thin encapsulation layer of TiO2 with high concentration and silicon glue is introduced to complement the main encapsulation one. After conducting experiments, the results present that in the case of the main encapsulation including only silicone, the light extraction efﬁciency (LEE) of COB LEDs increases to 65%. On the other hand, when there is the additional layer of TiO2 and silicone, the improvement of LEE depends on the concentration of TiO2. As this nanoparticle concentration decreases from 0.12 to 0.035 g/cm3, the LEE can be enhanced from 6% to 24%. Moreover, at the average correlated color temperature (CCT) of approximately 8500 K, the layer of TiO2/silicone composite can help to accomplish the reduction of the angular correlated color temperature (CCT) deviation, from 900 to 470 K, within −90° to 90° viewing angle range.
关键词：color uniformity;luminous flux;mie-scattering theory;TiO2