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  • 标题:Optimization of microfluidic layouts as a wired packing problem
  • 本地全文:下载
  • 作者:Sanjy Andriamiseza ; Mikael Trellet ; Nicolas Lafitte
  • 期刊名称:IFAC PapersOnLine
  • 印刷版ISSN:2405-8963
  • 出版年度:2021
  • 卷号:54
  • 期号:3
  • 页码:528-535
  • DOI:10.1016/j.ifacol.2021.08.296
  • 语种:English
  • 出版社:Elsevier
  • 摘要:AbstractThis paper presents a methodology to optimize the physical layout of microfluidic components, a key step in the design of custom microfluidic instruments that can be used in various process applications. A mathematical formulation is proposed under the form of a Mixed Integer Linear Problem allowing to treat non overlapping constraints for the multi-objective optimization of layout footprint and connectivity lengths. The method is numerically tested using randomly generated scenarios. Then, a real testcase serves as illustration.
  • 关键词:KeywordsMicrofluidicsoptimizationmathematical programmingdevice integration technologies
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