文章基本信息

标题：Simulation and analysis of energy consumption in the use of industrial building of wall panel
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作者：Zhiyong Li ; Zehua Zhang ; Yamei Cheng 等
期刊名称：IOP Conference Series: Earth and Environmental Science
印刷版ISSN：1755-1307
电子版ISSN：1755-1315
出版年度：2020
卷号：474
期号：5
页码：1-6
DOI：10.1088/1755-1315/474/5/052003
语种：English
出版社：IOP Publishing
摘要：The energy consumption of industrial building wall panels in the use phase is simulated. The temperature variation and heat transfer of wallboard with different thickness of insulation layer in different climate zones were studied. The results show that the difference of daily average heat transfer is less than 0.01 MJ/M2 for the wall panels with different thickness of insulation layer in the same city in summer. However, the daily average heat transfer among cities is quite different. The daily average heat transfer of Guangzhou wallboard is the largest, which is more than 1 MJ/m2, followed by Beijing. The average daily heat transfer is maintained above 0.69 MJ/m2, and Shanghai's wallboard has the least average daily heat transfer, only 0.32-0.33 MJ/m2. It can be known from the above data that Beijing needs to choose a composite wall board with a thermal insulation layer thickness of 6 cm in winter, Shanghai uses a composite wall board with a thermal insulation layer thickness of 4 cm, and Harbin chooses a composite wall board with a thermal insulation layer thickness of 6 cm or more to meet the insulation requirements.