文章基本信息

标题：Heat Transfer Analysis for New Product Development
本地全文：下载
作者：T R Sahroni
期刊名称：IOP Conference Series: Earth and Environmental Science
印刷版ISSN：1755-1307
电子版ISSN：1755-1315
出版年度：2020
卷号：426
期号：1
DOI：10.1088/1755-1315/426/1/012129
语种：English
出版社：IOP Publishing
摘要：This project presents an analysis of heat and mass transfer in designing a new product development. The problem in designing of electronic components to be mounted in Printed circuit board (PCB) is very complex due to significantly influence to reliability, safety, and cost effective. The objective of this study is to carry out the current problems related with heat and mass transfer analysis. The methodology used is started from cross-sectional heat transfer surface, Reynolds Number, heat transfer coefficient, heat flux, and last the maximum total power required. The result shows that a 15cm x 20cm of Printed Circuit Board (PCB) has an optimal heat and mass transfer coefficient to meet reliability and safety. In addition, the power degeneracy as function of the air velocity and the surface temperature are plotted. The simulation was generated, and it is represent the air velocity is vary from 1 m/s to 15 m/s and the external temperature surrounding on the printed circuit board is identified from 30°C to 100°C. As the result, the comprehensive value of heat and mass transfer coefficient is presented for new product development purposes.