文章基本信息

标题：Thin and Rectangular Die Bond Pick-Up Mechanism to Reduce Cracking During the Integrated Circuit Assembly Process
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作者：Ahmad R.A. Rahman ; Nazrul Anuar Nayan
期刊名称：Advances in Science and Technology Research Journal
印刷版ISSN：2080-4075
电子版ISSN：2299-8624
出版年度：2020
卷号：14
期号：3
页码：57-64
DOI：10.12913/22998624/123779
语种：English
出版社：Society of Polish Mechanical Engineers and Technicians
摘要：The demand for small, thin, and lightweight electronic devices is increasing. More advanced design and assem-bly processes of electronic packaging technology have developed to fulfill this need. The critical processes insemiconductor packaging involved in meeting the ever increasing demands of technology include wafer backgrinding, dicing, and die attachment. With low die thickness, the risk of die failure, which can cause functionaldamage, is high. In the die attach-ment process, the pin ejector causes an impact during the pick and placeprocess. Those effects can result in a micro indentation or micro crack under the die and would be the weakpoint throughout the entire process. This study designed and evaluated an ejector system for the die attachmentprocess. The proposed method uses a static pole heated inside the cavity for the plat-form to die before beingejected. Vacuum stabilizes the die suction. Moreover, heat softens the sawing tape and weakens the die adhe-sion. For die selection during the die attachment process, the results show that the critical die crack problem fora thin and rectangular die is solved using the proposed method. In summary, the packaging of semiconductorshas advanced to accommo-date the pick-up technology solution in relation to the challenging material neededfor the cur-rent miniaturization market trend and demand.
关键词：die attachment; miniaturization; integrated circuit; packaging process.