文章基本信息

标题：Effect of Bonding Temperature on Microstructure Evolution during TLP Bonding of a Ni 3Al based Superalloy IC10
本地全文：下载
作者：Xiong Yue ; Fengmei Liu ; Hexing Chen 等
期刊名称：MATEC Web of Conferences
电子版ISSN：2261-236X
出版年度：2018
卷号：206
DOI：10.1051/matecconf/201820603004
语种：English
出版社：EDP Sciences
摘要：Transient liquid phase (TLP) bonding of Ni3Al-based superalloy IC10 was carried out using the interlayer based on the base metal which added B and Hf as the melting point depressant elements. The effect of bonding temperature (1250 – 1270 °C) on the microstructure evolution of bonding joints were investigated. Microstructure of bonding joint composed of isothermally solidification zone (ISZ) formed γ’ phase and athermally solidified zone (ASZ) which consists of newly formed γ+γ’ reticular eutectic among with borides and carbides. Boride precipitates are not formed in diffusion affected zone (DAZ) and the boundary between ASZ and ISZ become not obvious. Isothermally solidification rate decreases as the increase of the bonding temperature.