文章基本信息

标题：Wire Bond Shear Test Simulation on Flat Surface Bond Pad
本地全文：下载
作者：Zaliman Sauli ; Zaliman Sauli ; Vithyacharan Retnasamy 等
期刊名称：Procedia - Social and Behavioral Sciences
印刷版ISSN：1877-0428
出版年度：2014
卷号：129
页码：328-333
DOI：10.1016/j.sbspro.2014.03.684
语种：English
出版社：Elsevier
摘要：AbstractThe reliability and the bond strength of wire bonding electronic packages are appraised using wire bond shear test. In this study, a three-dimensional non linear finite element model was designed to simulate the stress response of the bonded wire during wire bond shear test on a flat surface bond pad. Comparisons between three types of wire material:gold (Au), aluminium (Al) and copper (Cu) were done to scrutinize the effects of wire material on the stress response of bonded wire during wire bond shear test. The simulation results showed that copper wire bond induces higher stress compared to aluminium and gold wire bond during wire bond shear test.
关键词：Wirebond shear test;flat surface bond pad;ANSYS.