文章基本信息

标题：Overall Equipment Efficiency (OEE) Enhancement in Manufacture of Electronic Components & Boards Industry through Total Productive Maintenance Practices
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作者：Soo-Fen Fam ; Ser Lee Loh ; M. Haslinda 等
期刊名称：MATEC Web of Conferences
电子版ISSN：2261-236X
出版年度：2018
卷号：150
DOI：10.1051/matecconf/201815005037
语种：English
出版社：EDP Sciences
摘要：In an environment of intense global competition, both creative and proven strategies need to be considered in order to bring about the effectiveness and efficiency in manufacturing operation. Total Productive Maintenance (TPM) is one of the effective maintenance strategy in enhancing the equipment effectiveness and to achieve a significant competitive advantage. This research paper addresses the impact of three TPM pillars namely planned maintenance (PM), autonomous maintenance (AM) and focused maintenance (FM) on overall equipment effectiveness (OEE) of die attach equipment in the production line of semiconductor industry. The effect of TPM on the OEE is also investigated depending on the equipment types, in where die attach process consist of two models-CANON and ESEC. The primary data was collected from an organization's database and was analysed by SPSS V23. The preliminary results of the analysis showed that the performance of OEE in ESEC is better than the CANON after the implementation of TPM. The analysis also showed that out of the three TPM practices deployed, planned maintenance of equipment by production and maintenance team played the biggest role in increasing the equipment effectiveness. In conclusion, this study provides insights the importance of implementing TPM in order to succeed in a highly demanding market arena.