文章基本信息

标题：IMPACT OF THERMAL FATIGUE ON YOUNG’S MODULUS OF EPOXY ADHESIVES
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作者：Mariusz Kłonica ; Mariusz Kłonica
期刊名称：Advances in Science and Technology Research Journal
印刷版ISSN：2080-4075
电子版ISSN：2299-8624
出版年度：2015
卷号：9
期号：28
页码：103-106
DOI：10.12913/22998624/60795
语种：English
出版社：Society of Polish Mechanical Engineers and Technicians
摘要：The following paper presents a comparative analysis of two epoxy-based adhesives: Hysol 9466 and Hysol 3421, prior to and after thermal shock testing. The tests focused on determining Young’s modulus. Epoxy-based materials are among the most widespread adhesive materials used as universal structural adhesives. The prepared epoxy samples (Hysol 9466 and Hysol 3421) were subjected to thermal shock cycling tests, according to a specified programme, in a thermal shock testing chamber, at a temperature range –40 °C to +60 °C and in the number of 200 cycles. Conclusions from the tests are presented at the final stage of the paper.
关键词：Young’s modulus;epoxy adhesive;Hysol 9466;Hysol 3421;thermal shock