文章基本信息

标题：An Investigation of TiO2 Addition on Microstructure Evolution of Sn-Cu-Ni Solder Paste Composite
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作者：Norainiza Saud ; Norainiza Saud ; Rita Mohd Said 等
期刊名称：MATEC Web of Conferences
电子版ISSN：2261-236X
出版年度：2016
卷号：78
页码：1-5
DOI：10.1051/matecconf/20167801070
语种：English
出版社：EDP Sciences
摘要：In this research, varying fraction of titanium oxide (TiO2) reinforcement particles was successfully incorporated into Sn-Cu-Ni solder paste in an effort to study the influence of TiO2 addition on microstructure evolution of Sn-Cu-Ni solder paste composite. Sn-Cu-Ni solder paste composite was produced by mixing TiO2 particle with Sn-Cu-Ni solder paste. The microstructure analysis was carried out by Scanning Electron Microscopy-Energy dispersive X-ray (SEM-EDX). The addition TiO2 particle helps to refine the bulk solder microstructure and suppress the intermetallic compound (IMC) formation at the interface as will be discussed further.